Stick-slip dynamics in Ultrasonic Additive Manufacturing

James M. Gibert, Georges M. Fadel, Mohammed Daqaq

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultrasonic Additive Manufacturing is a solid state manufacturing process that combines ultrasonic welding of layers of thin metal foil with contour milling. Bonding between two foils is accomplished by holding the foils together under pressure and applying high-frequency excitations normal to the pressure direction. The accepted explanation for bonding is that stresses due to both compression and friction stemming from the interfacial motion between the foils result in plasticity and ultimately produce a metallurgical bond. The process however, has been shown to have a critical shortcoming in its operation; namely, the presence of a range of build heights within which bonding cannot be initiated. To better understand the reasons for this anomaly, this paper simplifies the process into a lumped parameter dry friction oscillator and shows that complex stick-slip motions of the build feature near or above its resonance frequency may explain bond degradation. Specifically, it is shown through bifurcation maps obtained for different process parameters that, at the critical build heights, the feature exhibits pure stick motions due to primary resonant interactions between the external excitation and the feature. Furthermore, complex aperiodic responses are observed at build heights above resonance (short features). In such scenarios, bonding cannot be initiated because no or non-uniform interfacial motions occur between the tape and the feature. It is also observed that, once the height of the build feature increases beyond the critical value corresponding to resonance, periodic uniform responses essential for bonding, are recovered. These results corroborates previous experimental findings which demonstrate that bonding can be hard to initiate near or slightly above resonance (at or slightly below a critical height) but can be reinitiated below resonance (above the critical height).

Original languageEnglish (US)
Title of host publicationASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012
Pages521-529
Number of pages9
Volume1
EditionPARTS A AND B
DOIs
StatePublished - Dec 1 2012
EventASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012 - Chicago, IL, United States
Duration: Aug 12 2012Aug 12 2012

Other

OtherASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012
CountryUnited States
CityChicago, IL
Period8/12/128/12/12

Fingerprint

3D printers
Stick-slip
Manufacturing
Ultrasonics
Metal foil
Motion
Excitation
Ultrasonic welding
Friction
Dry Friction
Resonance Frequency
Process Parameters
Welding
Plasticity
Tapes
Anomaly
Critical value
Simplify
Degradation
Compression

ASJC Scopus subject areas

  • Modeling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Gibert, J. M., Fadel, G. M., & Daqaq, M. (2012). Stick-slip dynamics in Ultrasonic Additive Manufacturing. In ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012 (PARTS A AND B ed., Vol. 1, pp. 521-529) https://doi.org/10.1115/DETC2012-70567

Stick-slip dynamics in Ultrasonic Additive Manufacturing. / Gibert, James M.; Fadel, Georges M.; Daqaq, Mohammed.

ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012. Vol. 1 PARTS A AND B. ed. 2012. p. 521-529.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gibert, JM, Fadel, GM & Daqaq, M 2012, Stick-slip dynamics in Ultrasonic Additive Manufacturing. in ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012. PARTS A AND B edn, vol. 1, pp. 521-529, ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012, Chicago, IL, United States, 8/12/12. https://doi.org/10.1115/DETC2012-70567
Gibert JM, Fadel GM, Daqaq M. Stick-slip dynamics in Ultrasonic Additive Manufacturing. In ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012. PARTS A AND B ed. Vol. 1. 2012. p. 521-529 https://doi.org/10.1115/DETC2012-70567
Gibert, James M. ; Fadel, Georges M. ; Daqaq, Mohammed. / Stick-slip dynamics in Ultrasonic Additive Manufacturing. ASME 2012 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2012. Vol. 1 PARTS A AND B. ed. 2012. pp. 521-529
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