Spectroscopic photon emission microscopy: A unique tool for failure analysis of microelectronics devices

Ingrid De Wolf, Mahmoud Rasras

Research output: Contribution to journalArticle

Abstract

Photon emission microscopy (PEM) is a technique used commonly for failure analysis of microelectronics chips. This technique has it limitations: it can only be used to indicate the place of the failure. In most cases, this is not enough to allow a definition of the failure, i.e. to find out whether it is due to a gate oxide breakdown, a metal short, a junction spiking, etc. In this paper spectral PEM is discussed. It is shown that the spectrum of the light emitted by the failure may offer valuable information about the identity of the failure.

Original languageEnglish (US)
Pages (from-to)1161-1169
Number of pages9
JournalMicroelectronics Reliability
Volume41
Issue number8
DOIs
StatePublished - Aug 1 2001

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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