Six-helix bundles designed from DNA

Frederick Mathieu, Shiping Liao, Jens Kopatsch, Tong Wang, Chengde Mao, Nadrian Seeman

Research output: Contribution to journalArticle

Abstract

We present a designed cyclic DNA motif that consists of six DNA double helices that are connected to each other at two crossover sites. DNA double helices with 10.5 nucleotide pairs per turn facilitate the programming of DNA double crossover molecules to form hexagonally symmetric arrangements when the crossover points are separated by seven or fourteen nucleotide pairs. We demonstrate by atomic force microscopy well-formed arrays of hexagonal six-helix bundle motifs both in 1D and in 2D.

Original languageEnglish (US)
Pages (from-to)661-665
Number of pages5
JournalNano Letters
Volume5
Issue number4
DOIs
StatePublished - Apr 2005

Fingerprint

helices
bundles
DNA
deoxyribonucleic acid
crossovers
nucleotides
Nucleotides
programming
Atomic force microscopy
atomic force microscopy
Molecules
molecules

ASJC Scopus subject areas

  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Chemistry (miscellaneous)

Cite this

Mathieu, F., Liao, S., Kopatsch, J., Wang, T., Mao, C., & Seeman, N. (2005). Six-helix bundles designed from DNA. Nano Letters, 5(4), 661-665. https://doi.org/10.1021/nl050084f

Six-helix bundles designed from DNA. / Mathieu, Frederick; Liao, Shiping; Kopatsch, Jens; Wang, Tong; Mao, Chengde; Seeman, Nadrian.

In: Nano Letters, Vol. 5, No. 4, 04.2005, p. 661-665.

Research output: Contribution to journalArticle

Mathieu, F, Liao, S, Kopatsch, J, Wang, T, Mao, C & Seeman, N 2005, 'Six-helix bundles designed from DNA', Nano Letters, vol. 5, no. 4, pp. 661-665. https://doi.org/10.1021/nl050084f
Mathieu F, Liao S, Kopatsch J, Wang T, Mao C, Seeman N. Six-helix bundles designed from DNA. Nano Letters. 2005 Apr;5(4):661-665. https://doi.org/10.1021/nl050084f
Mathieu, Frederick ; Liao, Shiping ; Kopatsch, Jens ; Wang, Tong ; Mao, Chengde ; Seeman, Nadrian. / Six-helix bundles designed from DNA. In: Nano Letters. 2005 ; Vol. 5, No. 4. pp. 661-665.
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