Sensibility testbed

An internet-wide cloud platform for programmable exploration of mobile devices

Yanyan Zhuang, Leonard Law, Albert Rafetseder, Lai Wang, Ivan Beschastnikh, Justin Cappos

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Smartphones contain sensors that provide information about the user of the device. Studying smartphones, therefore, provides an invaluable window into the behavioral patterns of users. In this work, we describe an open infrastructure that provides research communities with principled access to mobile devices and their sensors. Our platform, the Sensibility Testbed, is a free, community-driven platform for mobile devices. It provides secure data access to user-owned mobile devices while preserving user privacy. The unified programmable interface to sensors on heterogeneous devices in the Sensibility Testbed enables research scientists to design and deploy experiments that run across large numbers of devices, for example to measure the coverage and performance of cellular and WiFi networks. The Sensibility Testbed makes the sensing capabilities of smartphones more accessible to a broad range of researchers.

    Original languageEnglish (US)
    Title of host publication2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages139-140
    Number of pages2
    ISBN (Print)9781479930883
    DOIs
    StatePublished - 2014
    Event2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014 - Toronto, ON, Canada
    Duration: Apr 27 2014May 2 2014

    Other

    Other2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014
    CountryCanada
    CityToronto, ON
    Period4/27/145/2/14

    Fingerprint

    Smartphones
    Testbeds
    Mobile devices
    Internet
    Sensors
    Experiments

    ASJC Scopus subject areas

    • Computer Science(all)
    • Electrical and Electronic Engineering

    Cite this

    Zhuang, Y., Law, L., Rafetseder, A., Wang, L., Beschastnikh, I., & Cappos, J. (2014). Sensibility testbed: An internet-wide cloud platform for programmable exploration of mobile devices. In 2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014 (pp. 139-140). [6849194] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INFCOMW.2014.6849194

    Sensibility testbed : An internet-wide cloud platform for programmable exploration of mobile devices. / Zhuang, Yanyan; Law, Leonard; Rafetseder, Albert; Wang, Lai; Beschastnikh, Ivan; Cappos, Justin.

    2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 139-140 6849194.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Zhuang, Y, Law, L, Rafetseder, A, Wang, L, Beschastnikh, I & Cappos, J 2014, Sensibility testbed: An internet-wide cloud platform for programmable exploration of mobile devices. in 2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014., 6849194, Institute of Electrical and Electronics Engineers Inc., pp. 139-140, 2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014, Toronto, ON, Canada, 4/27/14. https://doi.org/10.1109/INFCOMW.2014.6849194
    Zhuang Y, Law L, Rafetseder A, Wang L, Beschastnikh I, Cappos J. Sensibility testbed: An internet-wide cloud platform for programmable exploration of mobile devices. In 2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 139-140. 6849194 https://doi.org/10.1109/INFCOMW.2014.6849194
    Zhuang, Yanyan ; Law, Leonard ; Rafetseder, Albert ; Wang, Lai ; Beschastnikh, Ivan ; Cappos, Justin. / Sensibility testbed : An internet-wide cloud platform for programmable exploration of mobile devices. 2014 IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 139-140
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