Pulsed DC, Gas-Flow Hollow Cathode Discharge: A Source for Sputter-Deposition

C. Paduraru, A. Belkind, K. Becker, J. Lopez, A. Delahoy, S. Y. Guo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Hollow cathode discharges with gas flow through the hole are used for deposition by sputtering and low-temperature plasma-enhanced chemical vapor deposition (PECVD). If DC power is used in conjunction with gases that react with the cathode material, arcing will occur. To avoid arcing caused by electrode surface contamination in a reactive gas atmosphere and to shorten the cathode activation-time and stabilize the discharge, pulsed DC power can be used. In this work, a pulsed DC hollow cathode discharge made from copper having a rectangular profile is investigated. The influence of pulsing power parameters, pressure, and gas flow on the plasma generated in various hollow cathodes are studied. Time-averaged Langmuir probe measurements and optical emission spectroscopy are used to characterize the remote plasma.

Original languageEnglish (US)
Title of host publicationProceedings, Annual Technical Conference - Society of Vacuum Coaters
Pages130-134
Number of pages5
StatePublished - 2003
Event46th Annual Technical Conference Proceedings - San Francisco, CA, United States
Duration: May 3 2003May 8 2003

Other

Other46th Annual Technical Conference Proceedings
CountryUnited States
CitySan Francisco, CA
Period5/3/035/8/03

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Keywords

  • Copper
  • Hollow cathode
  • Pulsed DC
  • Sputtering

ASJC Scopus subject areas

  • Mechanical Engineering
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Surfaces, Coatings and Films

Cite this

Paduraru, C., Belkind, A., Becker, K., Lopez, J., Delahoy, A., & Guo, S. Y. (2003). Pulsed DC, Gas-Flow Hollow Cathode Discharge: A Source for Sputter-Deposition. In Proceedings, Annual Technical Conference - Society of Vacuum Coaters (pp. 130-134)