Predictive techniques for projecting test data volume compression

Samah Mohamed Saeed, Ozgur Sinanoglu, Sobeeh Almukhaizim

Research output: Contribution to journalArticle

Abstract

Test data compression is widely employed in scan design to tackle high test data volume (TDV) and test time problems. Given the number of scan-in pins available in automated test equipment, architectural decisions regarding the number of internal scan chains directly impact the compression level attained. While targeting an aggressive compression level by increasing the number of internal scan chains would reduce the TDV per encodable pattern, the cost of serially applying more patterns to restore the coverage loss offsets the compression benefits. Following up from our earlier work, we propose here a wide spectrum of predictive techniques for projecting the test cost of a given scan configuration for combinational xor-based decompression. The appropriate technique is selected by designers based on which stage the design is in, the design abstraction and the amount of information available, the permissible computational complexity of the techniques, and the accuracy of the projected optimal compression ratio.

Original languageEnglish (US)
Article number6338363
Pages (from-to)1762-1766
Number of pages5
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume21
Issue number9
DOIs
StatePublished - Jan 1 2013

Fingerprint

Data compression
Costs
Computational complexity

Keywords

  • Compression ratio
  • predictive techniques in test
  • scan-based testing
  • test data compression

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Predictive techniques for projecting test data volume compression. / Saeed, Samah Mohamed; Sinanoglu, Ozgur; Almukhaizim, Sobeeh.

In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 21, No. 9, 6338363, 01.01.2013, p. 1762-1766.

Research output: Contribution to journalArticle

@article{7941bb49ab734f2a9ece6f680dd6f10b,
title = "Predictive techniques for projecting test data volume compression",
abstract = "Test data compression is widely employed in scan design to tackle high test data volume (TDV) and test time problems. Given the number of scan-in pins available in automated test equipment, architectural decisions regarding the number of internal scan chains directly impact the compression level attained. While targeting an aggressive compression level by increasing the number of internal scan chains would reduce the TDV per encodable pattern, the cost of serially applying more patterns to restore the coverage loss offsets the compression benefits. Following up from our earlier work, we propose here a wide spectrum of predictive techniques for projecting the test cost of a given scan configuration for combinational xor-based decompression. The appropriate technique is selected by designers based on which stage the design is in, the design abstraction and the amount of information available, the permissible computational complexity of the techniques, and the accuracy of the projected optimal compression ratio.",
keywords = "Compression ratio, predictive techniques in test, scan-based testing, test data compression",
author = "Saeed, {Samah Mohamed} and Ozgur Sinanoglu and Sobeeh Almukhaizim",
year = "2013",
month = "1",
day = "1",
doi = "10.1109/TVLSI.2012.2217359",
language = "English (US)",
volume = "21",
pages = "1762--1766",
journal = "IEEE Transactions on Very Large Scale Integration (VLSI) Systems",
issn = "1063-8210",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "9",

}

TY - JOUR

T1 - Predictive techniques for projecting test data volume compression

AU - Saeed, Samah Mohamed

AU - Sinanoglu, Ozgur

AU - Almukhaizim, Sobeeh

PY - 2013/1/1

Y1 - 2013/1/1

N2 - Test data compression is widely employed in scan design to tackle high test data volume (TDV) and test time problems. Given the number of scan-in pins available in automated test equipment, architectural decisions regarding the number of internal scan chains directly impact the compression level attained. While targeting an aggressive compression level by increasing the number of internal scan chains would reduce the TDV per encodable pattern, the cost of serially applying more patterns to restore the coverage loss offsets the compression benefits. Following up from our earlier work, we propose here a wide spectrum of predictive techniques for projecting the test cost of a given scan configuration for combinational xor-based decompression. The appropriate technique is selected by designers based on which stage the design is in, the design abstraction and the amount of information available, the permissible computational complexity of the techniques, and the accuracy of the projected optimal compression ratio.

AB - Test data compression is widely employed in scan design to tackle high test data volume (TDV) and test time problems. Given the number of scan-in pins available in automated test equipment, architectural decisions regarding the number of internal scan chains directly impact the compression level attained. While targeting an aggressive compression level by increasing the number of internal scan chains would reduce the TDV per encodable pattern, the cost of serially applying more patterns to restore the coverage loss offsets the compression benefits. Following up from our earlier work, we propose here a wide spectrum of predictive techniques for projecting the test cost of a given scan configuration for combinational xor-based decompression. The appropriate technique is selected by designers based on which stage the design is in, the design abstraction and the amount of information available, the permissible computational complexity of the techniques, and the accuracy of the projected optimal compression ratio.

KW - Compression ratio

KW - predictive techniques in test

KW - scan-based testing

KW - test data compression

UR - http://www.scopus.com/inward/record.url?scp=84881557231&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84881557231&partnerID=8YFLogxK

U2 - 10.1109/TVLSI.2012.2217359

DO - 10.1109/TVLSI.2012.2217359

M3 - Article

AN - SCOPUS:84881557231

VL - 21

SP - 1762

EP - 1766

JO - IEEE Transactions on Very Large Scale Integration (VLSI) Systems

JF - IEEE Transactions on Very Large Scale Integration (VLSI) Systems

SN - 1063-8210

IS - 9

M1 - 6338363

ER -