Piezo-PUF: Physical Unclonable Functions for Vacuum-Packaged, Piezoelectric MEMS

Alabi Bojesomo, Ibrahim Abe M. Elfadel, Ozgur Sinanoglu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The cyber and hardware security of constrained edge nodes have become a paramount requirement for the ultimate success of the Internet of Things (IoT). Such security needs to be guaranteed at minimum impact on energy efficiency and autonomy. One important approach to IoT energy autonmoy is the use of energy harvesters. In this paper, we select MEMS piezolelectric energy harvesters to propose a physically unclonable function (Piezo-PUF) which relies on the manufacturing uncertainties of the MEMS fabrication process. The major result of this paper is that several of the MEMS manufacturing uncertainties cannot be easily cloned, which leads to various mechanical and electrical features that can be leveraged for generating cryptographic keys. Thorough security analysis of Piezo-PUF has been conducted using wafer-level simulations and measurements. The security analysis confirms that Piezo-PUF qualifies as weak PUF for secure key generation and authentication.

Original languageEnglish (US)
Title of host publication2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728132860
DOIs
StatePublished - May 1 2019
Event2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 - Paris, France
Duration: May 12 2019May 15 2019

Publication series

Name2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Conference

Conference2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
CountryFrance
CityParis
Period5/12/195/15/19

Fingerprint

MEMS
Harvesters
Vacuum
Authentication
Energy efficiency
Fabrication
Hardware security
Uncertainty
Internet of things

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Bojesomo, A., Elfadel, I. A. M., & Sinanoglu, O. (2019). Piezo-PUF: Physical Unclonable Functions for Vacuum-Packaged, Piezoelectric MEMS. In 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 [8752778] (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2019.8752778

Piezo-PUF : Physical Unclonable Functions for Vacuum-Packaged, Piezoelectric MEMS. / Bojesomo, Alabi; Elfadel, Ibrahim Abe M.; Sinanoglu, Ozgur.

2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8752778 (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bojesomo, A, Elfadel, IAM & Sinanoglu, O 2019, Piezo-PUF: Physical Unclonable Functions for Vacuum-Packaged, Piezoelectric MEMS. in 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019., 8752778, 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019, Institute of Electrical and Electronics Engineers Inc., 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019, Paris, France, 5/12/19. https://doi.org/10.1109/DTIP.2019.8752778
Bojesomo A, Elfadel IAM, Sinanoglu O. Piezo-PUF: Physical Unclonable Functions for Vacuum-Packaged, Piezoelectric MEMS. In 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8752778. (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019). https://doi.org/10.1109/DTIP.2019.8752778
Bojesomo, Alabi ; Elfadel, Ibrahim Abe M. ; Sinanoglu, Ozgur. / Piezo-PUF : Physical Unclonable Functions for Vacuum-Packaged, Piezoelectric MEMS. 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019).
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