Multilayer integration of microwave and millimeter wave circuits: New interconnect methods and design considerations

Nirod Das, N Herscovici, G Kwan, DM Bolle

Research output: Chapter in Book/Report/Conference proceedingChapter (peer-reviewed)

Original languageEnglish (US)
Title of host publicationDirections for the next generation of MMIC devices and systems
EditorsNK Das, HL Bertoni
Place of PublicationNew York
PublisherPlenum Press
Pages83-95
StatePublished - May 1997

Cite this

Das, N., Herscovici, N., Kwan, G., & Bolle, DM. (1997). Multilayer integration of microwave and millimeter wave circuits: New interconnect methods and design considerations. In NK. Das, & HL. Bertoni (Eds.), Directions for the next generation of MMIC devices and systems (pp. 83-95). New York: Plenum Press.

Multilayer integration of microwave and millimeter wave circuits : New interconnect methods and design considerations. / Das, Nirod; Herscovici, N; Kwan, G; Bolle, DM.

Directions for the next generation of MMIC devices and systems. ed. / NK Das; HL Bertoni. New York : Plenum Press, 1997. p. 83-95.

Research output: Chapter in Book/Report/Conference proceedingChapter (peer-reviewed)

Das, N, Herscovici, N, Kwan, G & Bolle, DM 1997, Multilayer integration of microwave and millimeter wave circuits: New interconnect methods and design considerations. in NK Das & HL Bertoni (eds), Directions for the next generation of MMIC devices and systems. Plenum Press, New York, pp. 83-95.
Das N, Herscovici N, Kwan G, Bolle DM. Multilayer integration of microwave and millimeter wave circuits: New interconnect methods and design considerations. In Das NK, Bertoni HL, editors, Directions for the next generation of MMIC devices and systems. New York: Plenum Press. 1997. p. 83-95
Das, Nirod ; Herscovici, N ; Kwan, G ; Bolle, DM. / Multilayer integration of microwave and millimeter wave circuits : New interconnect methods and design considerations. Directions for the next generation of MMIC devices and systems. editor / NK Das ; HL Bertoni. New York : Plenum Press, 1997. pp. 83-95
@inbook{f349891da7c1415c81e80278aaf63a58,
title = "Multilayer integration of microwave and millimeter wave circuits: New interconnect methods and design considerations",
author = "Nirod Das and N Herscovici and G Kwan and DM Bolle",
year = "1997",
month = "5",
language = "English (US)",
pages = "83--95",
editor = "NK Das and HL Bertoni",
booktitle = "Directions for the next generation of MMIC devices and systems",
publisher = "Plenum Press",

}

TY - CHAP

T1 - Multilayer integration of microwave and millimeter wave circuits

T2 - New interconnect methods and design considerations

AU - Das, Nirod

AU - Herscovici, N

AU - Kwan, G

AU - Bolle, DM

PY - 1997/5

Y1 - 1997/5

M3 - Chapter (peer-reviewed)

SP - 83

EP - 95

BT - Directions for the next generation of MMIC devices and systems

A2 - Das, NK

A2 - Bertoni, HL

PB - Plenum Press

CY - New York

ER -