Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams

J. C W Ho, Quanyan Zhu, Ramesh Abhari

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, data transmission in transmission lines containing textured ground planes in the power distribution network is investigated. A lumped element model is developed to generate eye diagrams and circuit simulations are compared with measurements.

Original languageEnglish (US)
Title of host publicationIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
Pages195-198
Number of pages4
StatePublished - 2004
EventIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States
Duration: Oct 25 2004Oct 27 2004

Other

OtherIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityPortland, OR
Period10/25/0410/27/04

Fingerprint

Circuit simulation
Electric power distribution
Data communication systems
Electric lines

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Ho, J. C. W., Zhu, Q., & Abhari, R. (2004). Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams. In IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging (pp. 195-198)

Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams. / Ho, J. C W; Zhu, Quanyan; Abhari, Ramesh.

IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging. 2004. p. 195-198.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ho, JCW, Zhu, Q & Abhari, R 2004, Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams. in IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging. pp. 195-198, IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, United States, 10/25/04.
Ho JCW, Zhu Q, Abhari R. Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams. In IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging. 2004. p. 195-198
Ho, J. C W ; Zhu, Quanyan ; Abhari, Ramesh. / Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams. IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging. 2004. pp. 195-198
@inproceedings{0eb1b46a4e9f4a7e96a933b5b2183e66,
title = "Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams",
abstract = "In this paper, data transmission in transmission lines containing textured ground planes in the power distribution network is investigated. A lumped element model is developed to generate eye diagrams and circuit simulations are compared with measurements.",
author = "Ho, {J. C W} and Quanyan Zhu and Ramesh Abhari",
year = "2004",
language = "English (US)",
pages = "195--198",
booktitle = "IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging",

}

TY - GEN

T1 - Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams

AU - Ho, J. C W

AU - Zhu, Quanyan

AU - Abhari, Ramesh

PY - 2004

Y1 - 2004

N2 - In this paper, data transmission in transmission lines containing textured ground planes in the power distribution network is investigated. A lumped element model is developed to generate eye diagrams and circuit simulations are compared with measurements.

AB - In this paper, data transmission in transmission lines containing textured ground planes in the power distribution network is investigated. A lumped element model is developed to generate eye diagrams and circuit simulations are compared with measurements.

UR - http://www.scopus.com/inward/record.url?scp=15944400005&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=15944400005&partnerID=8YFLogxK

M3 - Conference contribution

SP - 195

EP - 198

BT - IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging

ER -