Minimum metallic conductivity and thermopower in thin palladium films

M. J. Burns, W. C. McGinnis, R. W. Simon, G. Deutscher, P. M. Chaikin

    Research output: Contribution to journalArticle

    Abstract

    The effects of two-dimensional electron localization have been studied by measuring thermopower and resistivity of thin (18-25) films of palladium. "Metallic" samples have a small thermopower which tends to zero as T0. Insulating samples have large thermopower which increases as T0. The metal-insulator transition in Pd films thus involves the opening of a gap at the Fermi energy. With use of the thermopower to define the metal-insulator transition a critical resistivity of 30 k/ is found.

    Original languageEnglish (US)
    Pages (from-to)1620-1624
    Number of pages5
    JournalPhysical Review Letters
    Volume47
    Issue number22
    DOIs
    StatePublished - 1981

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    palladium
    insulators
    conductivity
    electrical resistivity
    metals
    electrons
    energy

    ASJC Scopus subject areas

    • Physics and Astronomy(all)

    Cite this

    Burns, M. J., McGinnis, W. C., Simon, R. W., Deutscher, G., & Chaikin, P. M. (1981). Minimum metallic conductivity and thermopower in thin palladium films. Physical Review Letters, 47(22), 1620-1624. https://doi.org/10.1103/PhysRevLett.47.1620

    Minimum metallic conductivity and thermopower in thin palladium films. / Burns, M. J.; McGinnis, W. C.; Simon, R. W.; Deutscher, G.; Chaikin, P. M.

    In: Physical Review Letters, Vol. 47, No. 22, 1981, p. 1620-1624.

    Research output: Contribution to journalArticle

    Burns, MJ, McGinnis, WC, Simon, RW, Deutscher, G & Chaikin, PM 1981, 'Minimum metallic conductivity and thermopower in thin palladium films', Physical Review Letters, vol. 47, no. 22, pp. 1620-1624. https://doi.org/10.1103/PhysRevLett.47.1620
    Burns, M. J. ; McGinnis, W. C. ; Simon, R. W. ; Deutscher, G. ; Chaikin, P. M. / Minimum metallic conductivity and thermopower in thin palladium films. In: Physical Review Letters. 1981 ; Vol. 47, No. 22. pp. 1620-1624.
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