Layer transfer by controlled spalling

Stephen W. Bedell, Keith Fogel, Paul Lauro, Davood Shahrjerdi, John A. Ott, Devendra Sadana

Research output: Contribution to journalArticle

Abstract

In this communication, we present what may be the simplest method yet devised for removing surface layers from brittle substrates. The process is called controlled spalling technology (CST) and works by depositing a tensile stressor layer on the surface of a substrate, introducing a crack near the edge of the substrate, and mechanically guiding the crack as a single fracture front across the surface. The entire process is performed at room-temperature using only common laboratory equipment. We present here, for the first time, the specific process conditions required for controlled spalling of Ge 0 0 1 substrates using Ni as the stressor layer. We also illustrate the versatility of CST by removing completed CMOS circuits from a Si wafer and demonstrate functionality of the flexible circuits. Raman spectroscopy of spalled circuits with the Ni stressor intact indicates a residual compressive Si strain of 0.0029, in good agreement with the calculated value of 0.0022. Therefore, CST also permits new opportunities for strain engineering of nanoscale devices.

Original languageEnglish (US)
Article number152002
JournalJournal of Physics D: Applied Physics
Volume46
Issue number15
DOIs
StatePublished - Apr 17 2013

Fingerprint

spalling
Spalling
Substrates
Networks (circuits)
cracks
laboratory equipment
Cracks
versatility
Raman spectroscopy
CMOS
surface layers
communication
wafers
engineering
Communication
room temperature
Temperature

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials
  • Acoustics and Ultrasonics
  • Surfaces, Coatings and Films

Cite this

Bedell, S. W., Fogel, K., Lauro, P., Shahrjerdi, D., Ott, J. A., & Sadana, D. (2013). Layer transfer by controlled spalling. Journal of Physics D: Applied Physics, 46(15), [152002]. https://doi.org/10.1088/0022-3727/46/15/152002

Layer transfer by controlled spalling. / Bedell, Stephen W.; Fogel, Keith; Lauro, Paul; Shahrjerdi, Davood; Ott, John A.; Sadana, Devendra.

In: Journal of Physics D: Applied Physics, Vol. 46, No. 15, 152002, 17.04.2013.

Research output: Contribution to journalArticle

Bedell, Stephen W. ; Fogel, Keith ; Lauro, Paul ; Shahrjerdi, Davood ; Ott, John A. ; Sadana, Devendra. / Layer transfer by controlled spalling. In: Journal of Physics D: Applied Physics. 2013 ; Vol. 46, No. 15.
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