Innovative engineering outreach using Intel® security and embedded tools

Raghudeep Kannavara, Patrick Schaumont, Mihalis Maniatakos, Michael A. Smith, Scott Buck

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    During Spring 2013, the Evaluation Platforms Program from Intel and the Intel Software and Services Group donated Intel® Atom™ processor based development kits to the Electrical and Computer Engineering (ECE) Departments at Virginia Tech University and Polytechnic Institute of New York University (NYU Poly). The goal was to enable engineering faculty to develop projects based on Intel® security and embedded tools. The projects thus developed, key learnings and project outcomes are elucidated in this paper. Further, we evaluate the outreach projects to highlight the two different, yet important approaches to security curriculum development emphasizing security engineering versus security attacks.

    Original languageEnglish (US)
    Title of host publication10th European Workshop on Microelectronics Education, EWME 2014
    PublisherIEEE Computer Society
    Pages127-132
    Number of pages6
    ISBN (Print)9781479940165
    DOIs
    StatePublished - Jan 1 2014
    Event10th European Workshop on Microelectronics Education, EWME 2014 - Tallinn, Estonia
    Duration: May 14 2014May 16 2014

    Other

    Other10th European Workshop on Microelectronics Education, EWME 2014
    CountryEstonia
    CityTallinn
    Period5/14/145/16/14

    Fingerprint

    engineering
    Curricula
    curriculum development
    Atoms
    evaluation
    learning
    Group
    software

    Keywords

    • Computer Security
    • Embedded Platforms
    • Engineering Outreach

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Education

    Cite this

    Kannavara, R., Schaumont, P., Maniatakos, M., Smith, M. A., & Buck, S. (2014). Innovative engineering outreach using Intel® security and embedded tools. In 10th European Workshop on Microelectronics Education, EWME 2014 (pp. 127-132). [6877411] IEEE Computer Society. https://doi.org/10.1109/EWME.2014.6877411

    Innovative engineering outreach using Intel® security and embedded tools. / Kannavara, Raghudeep; Schaumont, Patrick; Maniatakos, Mihalis; Smith, Michael A.; Buck, Scott.

    10th European Workshop on Microelectronics Education, EWME 2014. IEEE Computer Society, 2014. p. 127-132 6877411.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Kannavara, R, Schaumont, P, Maniatakos, M, Smith, MA & Buck, S 2014, Innovative engineering outreach using Intel® security and embedded tools. in 10th European Workshop on Microelectronics Education, EWME 2014., 6877411, IEEE Computer Society, pp. 127-132, 10th European Workshop on Microelectronics Education, EWME 2014, Tallinn, Estonia, 5/14/14. https://doi.org/10.1109/EWME.2014.6877411
    Kannavara R, Schaumont P, Maniatakos M, Smith MA, Buck S. Innovative engineering outreach using Intel® security and embedded tools. In 10th European Workshop on Microelectronics Education, EWME 2014. IEEE Computer Society. 2014. p. 127-132. 6877411 https://doi.org/10.1109/EWME.2014.6877411
    Kannavara, Raghudeep ; Schaumont, Patrick ; Maniatakos, Mihalis ; Smith, Michael A. ; Buck, Scott. / Innovative engineering outreach using Intel® security and embedded tools. 10th European Workshop on Microelectronics Education, EWME 2014. IEEE Computer Society, 2014. pp. 127-132
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