Higher education internationalization: The Erasmus-Mundus network added value

Abdelaziz Bouras, Nopasit Chakpitak, Sebti Foufou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Higher education internationalization can play a major role in developing universities and students' capacities and their opportunities broadly throughout the world. Irrespective of contextual differences within and between countries, nearly all higher education institutions worldwide are engaged in international activities and are seeking to expand them. Engaging with the world is now considered part of the definition of quality in education and research. However, with the current crisis, possible tensions and counter reactions to the development of the internationalization can occur, such as an imminent resistance to a supposed denationalizing effect of internationalization, and related to that the possible development of a new form of local and regional identity, and the increasing influence of competition and market processes as driving factors in internationalization. In this paper we highlight a specific internationalization case study between Europe and South East Asia. We mainly explain the construction process of such historical collaboration, which is the essential element for its sustainability. We open.

Original languageEnglish (US)
Title of host publicationProceedings of 2014 International Conference on Interactive Collaborative Learning, ICL 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages849-854
Number of pages6
ISBN (Electronic)9781479944378
DOIs
StatePublished - Jan 1 2015
Event2014 International Conference on Interactive Collaborative Learning, ICL 2014 - Dubai, United Arab Emirates
Duration: Dec 3 2014Dec 6 2014

Other

Other2014 International Conference on Interactive Collaborative Learning, ICL 2014
CountryUnited Arab Emirates
CityDubai
Period12/3/1412/6/14

Fingerprint

internationalization
value added
Education
education
Sustainable development
regional identity
Students
sustainability
university
market
student

Keywords

  • Bilateral and multilateral collaboration
  • Erasmus-Mundus
  • Internationalization
  • Mobility
  • South East Asia

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Education

Cite this

Bouras, A., Chakpitak, N., & Foufou, S. (2015). Higher education internationalization: The Erasmus-Mundus network added value. In Proceedings of 2014 International Conference on Interactive Collaborative Learning, ICL 2014 (pp. 849-854). [7017884] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICL.2014.7017884

Higher education internationalization : The Erasmus-Mundus network added value. / Bouras, Abdelaziz; Chakpitak, Nopasit; Foufou, Sebti.

Proceedings of 2014 International Conference on Interactive Collaborative Learning, ICL 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 849-854 7017884.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bouras, A, Chakpitak, N & Foufou, S 2015, Higher education internationalization: The Erasmus-Mundus network added value. in Proceedings of 2014 International Conference on Interactive Collaborative Learning, ICL 2014., 7017884, Institute of Electrical and Electronics Engineers Inc., pp. 849-854, 2014 International Conference on Interactive Collaborative Learning, ICL 2014, Dubai, United Arab Emirates, 12/3/14. https://doi.org/10.1109/ICL.2014.7017884
Bouras A, Chakpitak N, Foufou S. Higher education internationalization: The Erasmus-Mundus network added value. In Proceedings of 2014 International Conference on Interactive Collaborative Learning, ICL 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 849-854. 7017884 https://doi.org/10.1109/ICL.2014.7017884
Bouras, Abdelaziz ; Chakpitak, Nopasit ; Foufou, Sebti. / Higher education internationalization : The Erasmus-Mundus network added value. Proceedings of 2014 International Conference on Interactive Collaborative Learning, ICL 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 849-854
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