High-Performance Flexible Electronic and Optoelectronic Devices by Mechanical Exfoliation from a Brittle Substrate

Research output: Chapter in Book/Report/Conference proceedingChapter


In this chapter, we consider high-performance flexible electronic devices based on thin crystalline materials such as silicon and compound semiconductors that are produced through mechanical exfoliation of thin device structures from a host substrate. In those approaches, mechanical exfoliation is achieved by utilizing a particular mode of substrate delamination, referred to as the spalling mode fracture. This mode of substrate cracking was originally considered a failure mode. In recent years, however, there has been an increased research activity to repurpose this phenomenon for producing thin semiconductor films. This chapter discusses the principles of the substrate cracking via spalling mode fracture and its application as a layer transfer technique for making high-performance electronic and optoelectric devices.

Original languageEnglish (US)
Title of host publicationSilicon Nanomembranes
Subtitle of host publicationFundamental Science and Applications
PublisherWiley-VCH Verlag
Number of pages23
ISBN (Electronic)9783527691005
ISBN (Print)9783527338313
StatePublished - Jun 20 2016



  • Flexible electronics
  • Integrated circuits
  • Layer transfer
  • Mechanical exfoliation
  • Nanoscale devices
  • Photovoltaic solar cells
  • Spalling mode fracture
  • Substrate cracking
  • Wearable electronics

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

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