Haptogram: Aerial display of 3D vibrotactile sensation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We introduce Haptogram, a system designed to provide a 3D tactile feedback by employing acoustic radiation pressure; similar to a hologram providing a 3D visual display. Haptogram system is made up of a two-dimensional array of ultrasonic transducers to project discrete points of tactile feedback moved in three orthogonal directions to create a 3D tactile experience. A mathematical model describing the Haptogram system is presented. A simulation experiment is conducted by constructing a 3D tactile hemisphere to showcase the proposed system. Simulation results are encouraging and good enough to implement the Haptogram system in our immediate future work.

Original languageEnglish (US)
Title of host publication2014 IEEE International Conference on Multimedia and Expo Workshops, ICMEW 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479947171
DOIs
StatePublished - Sep 3 2014
Event2014 IEEE International Conference on Multimedia and Expo Workshops, ICMEW 2014 - Chengdu, China
Duration: Jul 14 2014Jul 18 2014

Publication series

Name2014 IEEE International Conference on Multimedia and Expo Workshops, ICMEW 2014

Other

Other2014 IEEE International Conference on Multimedia and Expo Workshops, ICMEW 2014
CountryChina
CityChengdu
Period7/14/147/18/14

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Keywords

  • 3D Haptic interfaces
  • 3D tactile display
  • Aerial Display
  • Vibrotactile sensation

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition
  • Human-Computer Interaction

Cite this

Eid, M. (2014). Haptogram: Aerial display of 3D vibrotactile sensation. In 2014 IEEE International Conference on Multimedia and Expo Workshops, ICMEW 2014 [6890655] (2014 IEEE International Conference on Multimedia and Expo Workshops, ICMEW 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMEW.2014.6890655