DNA-templated self-assembly of metallic nanocomponent arrays on a surface

John D. Le, Yariv Pinto, Nadrian Seeman, Karin Musier-Forsyth, T. Andrew Taton, Richard A. Kiehl

Research output: Contribution to journalArticle

Abstract

A method for laying out arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We report programmed self-assembly of gold prototype nanoelectronic components into closely packed rows with precisely defined inter-row spacings by in situ hybridization of DNA-functionalized components to a preassembled 2D DNA scaffolding on a surface. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

Original languageEnglish (US)
Pages (from-to)2343-2347
Number of pages5
JournalNano Letters
Volume4
Issue number12
DOIs
StatePublished - Dec 2004

Fingerprint

Nanoelectronics
Self assembly
self assembly
DNA
deoxyribonucleic acid
Gold
Integrated circuits
Data storage equipment
integrated circuits
logic
prototypes
spacing
gold

ASJC Scopus subject areas

  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Chemistry (miscellaneous)

Cite this

Le, J. D., Pinto, Y., Seeman, N., Musier-Forsyth, K., Taton, T. A., & Kiehl, R. A. (2004). DNA-templated self-assembly of metallic nanocomponent arrays on a surface. Nano Letters, 4(12), 2343-2347. https://doi.org/10.1021/nl048635

DNA-templated self-assembly of metallic nanocomponent arrays on a surface. / Le, John D.; Pinto, Yariv; Seeman, Nadrian; Musier-Forsyth, Karin; Taton, T. Andrew; Kiehl, Richard A.

In: Nano Letters, Vol. 4, No. 12, 12.2004, p. 2343-2347.

Research output: Contribution to journalArticle

Le, JD, Pinto, Y, Seeman, N, Musier-Forsyth, K, Taton, TA & Kiehl, RA 2004, 'DNA-templated self-assembly of metallic nanocomponent arrays on a surface', Nano Letters, vol. 4, no. 12, pp. 2343-2347. https://doi.org/10.1021/nl048635
Le, John D. ; Pinto, Yariv ; Seeman, Nadrian ; Musier-Forsyth, Karin ; Taton, T. Andrew ; Kiehl, Richard A. / DNA-templated self-assembly of metallic nanocomponent arrays on a surface. In: Nano Letters. 2004 ; Vol. 4, No. 12. pp. 2343-2347.
@article{632693fc6ef2445ca45d19e2da19633d,
title = "DNA-templated self-assembly of metallic nanocomponent arrays on a surface",
abstract = "A method for laying out arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We report programmed self-assembly of gold prototype nanoelectronic components into closely packed rows with precisely defined inter-row spacings by in situ hybridization of DNA-functionalized components to a preassembled 2D DNA scaffolding on a surface. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.",
author = "Le, {John D.} and Yariv Pinto and Nadrian Seeman and Karin Musier-Forsyth and Taton, {T. Andrew} and Kiehl, {Richard A.}",
year = "2004",
month = "12",
doi = "10.1021/nl048635",
language = "English (US)",
volume = "4",
pages = "2343--2347",
journal = "Nano Letters",
issn = "1530-6984",
publisher = "American Chemical Society",
number = "12",

}

TY - JOUR

T1 - DNA-templated self-assembly of metallic nanocomponent arrays on a surface

AU - Le, John D.

AU - Pinto, Yariv

AU - Seeman, Nadrian

AU - Musier-Forsyth, Karin

AU - Taton, T. Andrew

AU - Kiehl, Richard A.

PY - 2004/12

Y1 - 2004/12

N2 - A method for laying out arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We report programmed self-assembly of gold prototype nanoelectronic components into closely packed rows with precisely defined inter-row spacings by in situ hybridization of DNA-functionalized components to a preassembled 2D DNA scaffolding on a surface. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

AB - A method for laying out arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We report programmed self-assembly of gold prototype nanoelectronic components into closely packed rows with precisely defined inter-row spacings by in situ hybridization of DNA-functionalized components to a preassembled 2D DNA scaffolding on a surface. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

UR - http://www.scopus.com/inward/record.url?scp=10844221797&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=10844221797&partnerID=8YFLogxK

U2 - 10.1021/nl048635

DO - 10.1021/nl048635

M3 - Article

VL - 4

SP - 2343

EP - 2347

JO - Nano Letters

JF - Nano Letters

SN - 1530-6984

IS - 12

ER -