DNA assembly of component arrays for nanoscale electronics

Richard A. Kiehl, John D. Le, Karin Musier-Forsyth, Yariv Y. Pinto, Nadrian C. Seeman, T. Andrew Taton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

Original languageEnglish (US)
Title of host publication2005 5th IEEE Conference on Nanotechnology
Pages5-8
Number of pages4
DOIs
StatePublished - Dec 1 2005
Event2005 5th IEEE Conference on Nanotechnology - Nagoya, Japan
Duration: Jul 11 2005Jul 15 2005

Publication series

Name2005 5th IEEE Conference on Nanotechnology
Volume2

Other

Other2005 5th IEEE Conference on Nanotechnology
CountryJapan
CityNagoya
Period7/11/057/15/05

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Keywords

  • Integrated circuit fabrication
  • Molecular electronics
  • Nanotechnology

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kiehl, R. A., Le, J. D., Musier-Forsyth, K., Pinto, Y. Y., Seeman, N. C., & Andrew Taton, T. (2005). DNA assembly of component arrays for nanoscale electronics. In 2005 5th IEEE Conference on Nanotechnology (pp. 5-8). [1500636] (2005 5th IEEE Conference on Nanotechnology; Vol. 2). https://doi.org/10.1109/NANO.2005.1500636