Deposition and characterization of silver nano-films by a novel solid liquid interface reaction technique (SLIRT)

P. D. Godbole, A. Mitra, Renu Pasricha, A. B. Mandale, K. R. Patil

Research output: Contribution to journalArticle

Abstract

Solid-liquid interface reaction technique (SLIRT) is used to deposit silver film on glass substrate. The solid film of silver nitrate is formed by modified spin coating method. This film is subsequently processed by dipping it in a reducing solution so as to initiate a reaction at the interface and ultimately transform it to totally silver film. In situ transformation of silver nitrate to silver is studied with respect to time spectrophotometrically. The characterization of silver film is done by various physicochemical techniques namely XRD, XPS, ED, TEM and UV visible spectroscopy.

Original languageEnglish (US)
Pages (from-to)1958-1961
Number of pages4
JournalMaterials Letters
Volume59
Issue number14-15
DOIs
StatePublished - Jun 1 2005

Fingerprint

liquid-solid interfaces
Silver
silver
Liquids
Silver Nitrate
silver nitrates
Nitrates
Silver deposits
Spin coating
dipping
coating
X ray photoelectron spectroscopy
deposits
Spectroscopy
Transmission electron microscopy
Glass
transmission electron microscopy
glass
Substrates
spectroscopy

Keywords

  • Electron microscopy
  • Nano-particles
  • Solid-liquid interface reaction
  • Thin film

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Deposition and characterization of silver nano-films by a novel solid liquid interface reaction technique (SLIRT). / Godbole, P. D.; Mitra, A.; Pasricha, Renu; Mandale, A. B.; Patil, K. R.

In: Materials Letters, Vol. 59, No. 14-15, 01.06.2005, p. 1958-1961.

Research output: Contribution to journalArticle

Godbole, P. D. ; Mitra, A. ; Pasricha, Renu ; Mandale, A. B. ; Patil, K. R. / Deposition and characterization of silver nano-films by a novel solid liquid interface reaction technique (SLIRT). In: Materials Letters. 2005 ; Vol. 59, No. 14-15. pp. 1958-1961.
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