Comparative calorimetric study of epoxy cure by microwave vs thermal energy

Jovan Mijovic, Jony Wijaya

Research output: Contribution to journalArticle

Abstract

An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (Tg) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195°C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields.

Original languageEnglish (US)
Pages (from-to)3671-3674
Number of pages4
JournalMacromolecules
Volume23
Issue number15
StatePublished - 1990

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Thermal energy
Microwaves
Glass transition
Epoxy Resins
Microwave circuits
Sulfones
Epoxy resins
Curing
Differential scanning calorimetry
Ethers
Temperature
Kinetics
Hot Temperature

ASJC Scopus subject areas

  • Materials Chemistry

Cite this

Comparative calorimetric study of epoxy cure by microwave vs thermal energy. / Mijovic, Jovan; Wijaya, Jony.

In: Macromolecules, Vol. 23, No. 15, 1990, p. 3671-3674.

Research output: Contribution to journalArticle

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