Clotho

Proactive wearout deceleration in Chip-Multiprocessor interconnects

Arseniy Vitkovskiy, Vassos Soteriou Soteriou, Paul V. Gratz

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    With advancing process technology, Chip-Multiprocessors (CMPs) are experiencing ever worsening reliability due to prolonged operational stresses. The network-on-chip that interconnects the components of CMPs is especially vulnerable to such wearout-induced failure. To tackle this ominous threat we present Clotho, a novel, wearout-Aware routing algorithm. Clotho continuously considers the stresses the on-chip interconnect experiences at runtime, along with temperature and fabrication process variation metrics, steering traffic away from locations that are most prone to Electromigration (EM)-and Hot-Carrier Injection (HCI)-induced wear. Under realistic workloads Clotho yields 66% and 8% average increases in mean time to failure for EM and HCI, respectively.

    Original languageEnglish (US)
    Title of host publicationProceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages117-124
    Number of pages8
    ISBN (Electronic)9781467371650
    DOIs
    StatePublished - Dec 14 2015
    Event33rd IEEE International Conference on Computer Design, ICCD 2015 - New York City, United States
    Duration: Oct 18 2015Oct 21 2015

    Other

    Other33rd IEEE International Conference on Computer Design, ICCD 2015
    CountryUnited States
    CityNew York City
    Period10/18/1510/21/15

    Fingerprint

    Hot carriers
    Electromigration
    Deceleration
    Routing algorithms
    Wear of materials
    Fabrication
    Temperature
    Network-on-chip

    ASJC Scopus subject areas

    • Computer Graphics and Computer-Aided Design
    • Computer Science Applications

    Cite this

    Vitkovskiy, A., Soteriou, V. S., & Gratz, P. V. (2015). Clotho: Proactive wearout deceleration in Chip-Multiprocessor interconnects. In Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015 (pp. 117-124). [7357092] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCD.2015.7357092

    Clotho : Proactive wearout deceleration in Chip-Multiprocessor interconnects. / Vitkovskiy, Arseniy; Soteriou, Vassos Soteriou; Gratz, Paul V.

    Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 117-124 7357092.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Vitkovskiy, A, Soteriou, VS & Gratz, PV 2015, Clotho: Proactive wearout deceleration in Chip-Multiprocessor interconnects. in Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015., 7357092, Institute of Electrical and Electronics Engineers Inc., pp. 117-124, 33rd IEEE International Conference on Computer Design, ICCD 2015, New York City, United States, 10/18/15. https://doi.org/10.1109/ICCD.2015.7357092
    Vitkovskiy A, Soteriou VS, Gratz PV. Clotho: Proactive wearout deceleration in Chip-Multiprocessor interconnects. In Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 117-124. 7357092 https://doi.org/10.1109/ICCD.2015.7357092
    Vitkovskiy, Arseniy ; Soteriou, Vassos Soteriou ; Gratz, Paul V. / Clotho : Proactive wearout deceleration in Chip-Multiprocessor interconnects. Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 117-124
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