Best of both worlds

Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs

Satwik Patnaik, Mohammed Ashraf, Ozgur Sinanoglu, Johann Knechtel

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for "the best of both worlds," that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.

    Original languageEnglish (US)
    Title of host publication2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    ISBN (Electronic)9781450359504
    DOIs
    StatePublished - Nov 5 2018
    Event37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - San Diego, United States
    Duration: Nov 5 2018Nov 8 2018

    Other

    Other37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018
    CountryUnited States
    CitySan Diego
    Period11/5/1811/8/18

    Fingerprint

    Computer aided design
    Intellectual property
    Reverse engineering
    Foundries
    Supply chains
    Industry
    Experiments

    ASJC Scopus subject areas

    • Software
    • Computer Science Applications
    • Computer Graphics and Computer-Aided Design

    Cite this

    Patnaik, S., Ashraf, M., Sinanoglu, O., & Knechtel, J. (2018). Best of both worlds: Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs. In 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers [a8] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/3240765.3240784

    Best of both worlds : Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs. / Patnaik, Satwik; Ashraf, Mohammed; Sinanoglu, Ozgur; Knechtel, Johann.

    2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018. a8.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Patnaik, S, Ashraf, M, Sinanoglu, O & Knechtel, J 2018, Best of both worlds: Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs. in 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers., a8, Institute of Electrical and Electronics Engineers Inc., 37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018, San Diego, United States, 11/5/18. https://doi.org/10.1145/3240765.3240784
    Patnaik S, Ashraf M, Sinanoglu O, Knechtel J. Best of both worlds: Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs. In 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2018. a8 https://doi.org/10.1145/3240765.3240784
    Patnaik, Satwik ; Ashraf, Mohammed ; Sinanoglu, Ozgur ; Knechtel, Johann. / Best of both worlds : Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs. 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2018.
    @inproceedings{f7c2851f0cd249c2869aee3913d6617f,
    title = "Best of both worlds: Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs",
    abstract = "With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for {"}the best of both worlds,{"} that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.",
    author = "Satwik Patnaik and Mohammed Ashraf and Ozgur Sinanoglu and Johann Knechtel",
    year = "2018",
    month = "11",
    day = "5",
    doi = "10.1145/3240765.3240784",
    language = "English (US)",
    booktitle = "2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers",
    publisher = "Institute of Electrical and Electronics Engineers Inc.",

    }

    TY - GEN

    T1 - Best of both worlds

    T2 - Integration of split manufacturing and camouflaging into a security-driven CAD flow for 3D ICs

    AU - Patnaik, Satwik

    AU - Ashraf, Mohammed

    AU - Sinanoglu, Ozgur

    AU - Knechtel, Johann

    PY - 2018/11/5

    Y1 - 2018/11/5

    N2 - With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for "the best of both worlds," that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.

    AB - With the globalization of manufacturing and supply chains, ensuring the security and trustworthiness of ICs has become an urgent challenge. Split manufacturing (SM) and layout camouflaging (LC) are promising techniques to protect the intellectual property (IP) of ICs from malicious entities during and after manufacturing (i.e., from untrusted foundries and reverse-engineering by end-users). In this paper, we strive for "the best of both worlds," that is of SM and LC. To do so, we extend both techniques towards 3D integration, an up-and-coming design and manufacturing paradigm based on stacking and interconnecting of multiple chips/dies/tiers. Initially, we review prior art and their limitations. We also put forward a novel, practical threat model of IP piracy which is in line with the business models of present-day design houses. Next, we discuss how 3D integration is a naturally strong match to combine SM and LC. We propose a security-driven CAD and manufacturing flow for face-to-face (F2F) 3D ICs, along with obfuscation of interconnects. Based on this CAD flow, we conduct comprehensive experiments on DRC-clean layouts. Strengthened by an extensive security analysis (also based on a novel attack to recover obfuscated F2F interconnects), we argue that entering the next, third dimension is eminent for effective and efficient IP protection.

    UR - http://www.scopus.com/inward/record.url?scp=85058186572&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=85058186572&partnerID=8YFLogxK

    U2 - 10.1145/3240765.3240784

    DO - 10.1145/3240765.3240784

    M3 - Conference contribution

    BT - 2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers

    PB - Institute of Electrical and Electronics Engineers Inc.

    ER -