Advanced flexible electronics

Challenges and opportunities

Stephen W. Bedell, Davood Shahrjerdi, Keith Fogel, Paul Lauro, Can Bayram, Bahman Hekmatshoar, Ning Li, John Ott, Devendra Sadana

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.

Original languageEnglish (US)
Title of host publicationMicro- and Nanotechnology Sensors, Systems, and Applications VI
PublisherSPIE
Volume9083
ISBN (Print)9781628410204
DOIs
StatePublished - 2014
EventMicro- and Nanotechnology Sensors, Systems, and Applications VI - Baltimore, MD, United States
Duration: May 5 2014May 9 2014

Other

OtherMicro- and Nanotechnology Sensors, Systems, and Applications VI
CountryUnited States
CityBaltimore, MD
Period5/5/145/9/14

Fingerprint

Flexible electronics
Electronics
spalling
Solid-state Lighting
electronics
Spalling
illuminating
High Performance
Substrate
products
solid state
Substrates
Lighting
microelectronics
integrated circuits
surface layers
Integrated Circuits
flexibility
Microelectronics
industries

Keywords

  • Flexible circuits
  • Fracture
  • Gallium nitride
  • Layer transfer
  • Photovoltaics

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Bedell, S. W., Shahrjerdi, D., Fogel, K., Lauro, P., Bayram, C., Hekmatshoar, B., ... Sadana, D. (2014). Advanced flexible electronics: Challenges and opportunities. In Micro- and Nanotechnology Sensors, Systems, and Applications VI (Vol. 9083). [90831G] SPIE. https://doi.org/10.1117/12.2051716

Advanced flexible electronics : Challenges and opportunities. / Bedell, Stephen W.; Shahrjerdi, Davood; Fogel, Keith; Lauro, Paul; Bayram, Can; Hekmatshoar, Bahman; Li, Ning; Ott, John; Sadana, Devendra.

Micro- and Nanotechnology Sensors, Systems, and Applications VI. Vol. 9083 SPIE, 2014. 90831G.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bedell, SW, Shahrjerdi, D, Fogel, K, Lauro, P, Bayram, C, Hekmatshoar, B, Li, N, Ott, J & Sadana, D 2014, Advanced flexible electronics: Challenges and opportunities. in Micro- and Nanotechnology Sensors, Systems, and Applications VI. vol. 9083, 90831G, SPIE, Micro- and Nanotechnology Sensors, Systems, and Applications VI, Baltimore, MD, United States, 5/5/14. https://doi.org/10.1117/12.2051716
Bedell SW, Shahrjerdi D, Fogel K, Lauro P, Bayram C, Hekmatshoar B et al. Advanced flexible electronics: Challenges and opportunities. In Micro- and Nanotechnology Sensors, Systems, and Applications VI. Vol. 9083. SPIE. 2014. 90831G https://doi.org/10.1117/12.2051716
Bedell, Stephen W. ; Shahrjerdi, Davood ; Fogel, Keith ; Lauro, Paul ; Bayram, Can ; Hekmatshoar, Bahman ; Li, Ning ; Ott, John ; Sadana, Devendra. / Advanced flexible electronics : Challenges and opportunities. Micro- and Nanotechnology Sensors, Systems, and Applications VI. Vol. 9083 SPIE, 2014.
@inproceedings{55f0132569fc4b0795d49df83e587b4d,
title = "Advanced flexible electronics: Challenges and opportunities",
abstract = "Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.",
keywords = "Flexible circuits, Fracture, Gallium nitride, Layer transfer, Photovoltaics",
author = "Bedell, {Stephen W.} and Davood Shahrjerdi and Keith Fogel and Paul Lauro and Can Bayram and Bahman Hekmatshoar and Ning Li and John Ott and Devendra Sadana",
year = "2014",
doi = "10.1117/12.2051716",
language = "English (US)",
isbn = "9781628410204",
volume = "9083",
booktitle = "Micro- and Nanotechnology Sensors, Systems, and Applications VI",
publisher = "SPIE",

}

TY - GEN

T1 - Advanced flexible electronics

T2 - Challenges and opportunities

AU - Bedell, Stephen W.

AU - Shahrjerdi, Davood

AU - Fogel, Keith

AU - Lauro, Paul

AU - Bayram, Can

AU - Hekmatshoar, Bahman

AU - Li, Ning

AU - Ott, John

AU - Sadana, Devendra

PY - 2014

Y1 - 2014

N2 - Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.

AB - Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.

KW - Flexible circuits

KW - Fracture

KW - Gallium nitride

KW - Layer transfer

KW - Photovoltaics

UR - http://www.scopus.com/inward/record.url?scp=84905728025&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84905728025&partnerID=8YFLogxK

U2 - 10.1117/12.2051716

DO - 10.1117/12.2051716

M3 - Conference contribution

SN - 9781628410204

VL - 9083

BT - Micro- and Nanotechnology Sensors, Systems, and Applications VI

PB - SPIE

ER -