Adhesion studies using contact mechanics

Abraham Ulman, Gun Young Choi, Yitzhak Shnidman, Walter Zurawsky

Research output: Contribution to journalArticle

Abstract

We report adhesion studies using the JKR contact mechanics method and poly(dimethylsiloxane) (PDMS) cross-linked networks. When such networks are extracted, interdigitation of tethered chains into extraction zones at the network-network interface results in a significant enhancement of adhesion. When these networks come into contact with a silicon oxide surface, an increase in adhesion hysteresis is observed in the order of increasing molecular weight between cross-links, with a scaling factor of 1/2. Subjecting the system to maximum load for 30 min before unloading results in a scaling factor of 1/3, probably due to molecular weight dependent network relaxation rates. PDMS cross-link networks form H-bonds with surface Si-OH groups that result in significant and time-dependent adhesion increase. Systematic studies of interfacial H-bonding and its effect on adhesion have been carried out using self-assembled monolayer (SAM) surfaces. An increase in adhesion strength was observed in the order of increasing acidity of surface OH protons [Au/S(CH2)11OH < Au/S(C6H4)2OH < Au/S(CH2)15COOH < Au/ S(CH2)11PO(OH)2]. When surface OH concentration was controlled, the strength of adhesion was found to be proportional to the number of surface OH groups, with nonlinear relationship, probably due to the collective nature of H-bonding between the PDMS chain and surface OH groups. Isotope effect studies confirmed the formation of interfacial H-bonding.

Original languageEnglish (US)
Pages (from-to)107-121
Number of pages15
JournalIsrael Journal of Chemistry
Volume40
Issue number2
StatePublished - 2000

Fingerprint

Mechanics
Adhesion
Molecular weight
Bond strength (materials)
Silicon oxides
Self assembled monolayers
Unloading
Acidity
Isotopes
Interfaces (computer)
Hysteresis
Protons
baysilon

ASJC Scopus subject areas

  • Chemistry(all)

Cite this

Ulman, A., Choi, G. Y., Shnidman, Y., & Zurawsky, W. (2000). Adhesion studies using contact mechanics. Israel Journal of Chemistry, 40(2), 107-121.

Adhesion studies using contact mechanics. / Ulman, Abraham; Choi, Gun Young; Shnidman, Yitzhak; Zurawsky, Walter.

In: Israel Journal of Chemistry, Vol. 40, No. 2, 2000, p. 107-121.

Research output: Contribution to journalArticle

Ulman, A, Choi, GY, Shnidman, Y & Zurawsky, W 2000, 'Adhesion studies using contact mechanics', Israel Journal of Chemistry, vol. 40, no. 2, pp. 107-121.
Ulman A, Choi GY, Shnidman Y, Zurawsky W. Adhesion studies using contact mechanics. Israel Journal of Chemistry. 2000;40(2):107-121.
Ulman, Abraham ; Choi, Gun Young ; Shnidman, Yitzhak ; Zurawsky, Walter. / Adhesion studies using contact mechanics. In: Israel Journal of Chemistry. 2000 ; Vol. 40, No. 2. pp. 107-121.
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